The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Jun. 04, 2007
Toshinori Ogashiwa, Hiratsuka, JP;
Masayuki Miyairi, Hiratsuka, JP;
Toshinori Ogashiwa, Hiratsuka, JP;
Masayuki Miyairi, Hiratsuka, JP;
Tanaka Kikinzoku Kogyo K.K., Tokyo, JP;
Abstract
The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal pastewas applied to a semiconductor chipthe metal pasteconsisting of metal powder of one or more kinds selected from gold powder, silver powder, platinum powder, and palladium powder having a purity not lower than 99.9 wt % and an average particle diameter of 0.005 μm to 1.0 μm and an organic solvent. After being applied, the metal pastewas dried in a vacuum in a dryer. The chip was heated at 230° C. for 30 minutes to sinter the metal paste, by which a metal powder sintered compactwas formed. Next, a nickel platewas placed on the semiconductor chipand bonded to the semiconductor chipby heating and pressurization.