The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2010

Filed:

Jun. 26, 2006
Applicants:

Hideaki Nonaka, Tokyo, JP;

Kan Nakata, Tokyo, JP;

Kenji Kobayashi, Tokyo, JP;

Inventors:

Hideaki Nonaka, Tokyo, JP;

Kan Nakata, Tokyo, JP;

Kenji Kobayashi, Tokyo, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sheet sticking apparatuscomprises a sheet feed-out unitfor feeding out an adhesive sheet S to a position facing a surface of a semiconductor wafer W, and a press rollerfor imparting a press force to the adhesive sheet S to stick the adhesive sheet S to the wafer W. The sheet feed-out unitincludes a tension measuring meansfor measuring the tension of the adhesive sheet S between a feed-out headand the press roller. The tension measuring meansmaintains the tension to a constant level to prevent catching of air bubbles between the adhesive sheet S and the wafer W as well as to prevent warp deformation of the wafer stuck with the sheet.


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