The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Dec. 01, 2006
Jiro Chiba, Yokohama, JP;
Atsuo Hiroi, Funabashi, JP;
Ryosuke Sugiura, Funabashi, JP;
Ryoji Akiyama, Tokyo, JP;
Masaya Matsunaga, Tokyo, JP;
Jiro Chiba, Yokohama, JP;
Atsuo Hiroi, Funabashi, JP;
Ryosuke Sugiura, Funabashi, JP;
Ryoji Akiyama, Tokyo, JP;
Masaya Matsunaga, Tokyo, JP;
Asahi Glass Company, Limited, Tokyo, JP;
Asahi Techno Glass Corporation, Funabashi-shi, JP;
Abstract
To provide a process for producing a reliable substrate in good yield, by suppressing bleeding of boric acid from a green sheet comprising a powder of borosilicate glass to improve printability of a conductive pattern thereby to prevent disconnection. A process for producing a substrate which comprises firing a green sheet comprising a powder of borosilicate glass, wherein the powder is one prepared by holding borosilicate glass before pulverization, at a temperature higher by at least 30° C. than the glass transition temperature and lower by at most 50° C. than the softening point of the borosilicate glass for at least 3 hours in the atmosphere, followed by pulverization.