The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2010

Filed:

Jun. 25, 2007
Applicants:

Yung-tai Hung, Chiayi, TW;

Jen-chuan Pan, Kaohsiung, TW;

Chin-ta Su, Yunlin, TW;

Ta-hung Yang, Miaoli, TW;

Inventors:

Yung-Tai Hung, Chiayi, TW;

Jen-Chuan Pan, Kaohsiung, TW;

Chin-Ta Su, Yunlin, TW;

Ta-Hung Yang, Miaoli, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

A metal pad formation method and metal pad structure using the same are provided. A wider first pad metal is formed together with a first metal. A dielectric layer is then deposited thereon. A first opening and a second opening are formed in the dielectric layer to respectively expose the first metal and the first pad metal. Then, the first opening is filled by W metal to generate a first via. Finally, a second metal and a second pad metal are formed to respectively cover the first via and the first pad metal to generate the metal pad.


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