The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Sep. 14, 2007
Francois Neuilly, Colomby-sur-Thaon, FR;
David D. R. Chevrie, Bretteville sur Odon, FR;
Dominique Yon, Saint Aubin sur Mer, FR;
Francois Neuilly, Colomby-sur-Thaon, FR;
David D. R. Chevrie, Bretteville sur Odon, FR;
Dominique Yon, Saint Aubin sur Mer, FR;
IPDIA, Caen, FR;
Abstract
The present invention provides a method for making a vertical interconnect through a substrate. The method makes use of a sacrificial buried layerarranged in between the first sideand the second sideof a substrate. After having etched trenchesand' from the first side, the sacrificial buried layerfunctions as a stop layer during etching of holesand′ from the second side, therewith protecting the trenches from damage during overetch of the holes. The etching of trenches is completely decoupled from etching of the holes providing several advantages for process choice and device manufacture. After removing part of the sacrificial buried layer to interconnect the trenches and the holes, the resulting vertical interconnect hole is filled to form a vertical interconnect.