The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Jul. 27, 2006
Applicants:
Hideaki Nonaka, Tokyo, JP;
Kenji Kobayashi, Tokyo, JP;
Inventors:
Hideaki Nonaka, Tokyo, JP;
Kenji Kobayashi, Tokyo, JP;
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Wafers W are supported respectively on inner tablesof a table, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press rollerimparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blademounted at the free-end side of a robot. The robothas a function to exchange the cutter bladewith a suction arm, to transfer the wafer W from a magazineto the tableand to transfer the wafer W stuck with the sheet to the next process.