The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2010

Filed:

Apr. 04, 2007
Applicants:

Hiroaki Kodama, Ibi-gun, JP;

Toyoaki Tanaka, Ibi-gun, JP;

Kazuhito Yamada, Ibi-gun, JP;

Inventors:

Hiroaki Kodama, Ibi-gun, JP;

Toyoaki Tanaka, Ibi-gun, JP;

Kazuhito Yamada, Ibi-gun, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
Abstract

The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.


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