The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Aug. 09, 2007
Tadatomo Suga, Nakano-ku, Tokyo 164-0003, JP;
Toshihiro Itoh, Chiba, JP;
Tadatomo Suga, Nakano-ku, Tokyo 164-0003, JP;
Toshihiro Itoh, Chiba, JP;
Renesas Technology Corp., Tokyo, JP;
Other;
Oki Semiconductor Co., Ltd., Tokyo, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Sony Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Fujitsu Limited, Kanagawa, JP;
Panasonic Corporation, Osaka, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.