The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2010

Filed:

May. 30, 2007
Applicants:

Chia-wei Wu, Hsinchu, TW;

Jung-yu Shieh, Hsinchu, TW;

Ling-wu Yang, Hsinchu, TW;

Inventors:

Chia-Wei Wu, Hsinchu, TW;

Jung-Yu Shieh, Hsinchu, TW;

Ling-Wu Yang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/465 (2006.01);
U.S. Cl.
CPC ...
Abstract

An etching solution, a method of surface modification of a semiconductor substrate and a method of forming shallow trench isolation are provided. The etching solution is used for surface modifying the semiconductor substrate. The etching solution includes an oxidant and an oxide remover. The semiconductor substrate is oxidized to a semiconductor oxide by the oxidant, and the oxide remover subtracts the semiconductor oxide.


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