The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Feb. 02, 2005
Applicant:
Masao Kaizuka, San Jose, CA (US);
Inventor:
Masao Kaizuka, San Jose, CA (US);
Assignee:
Toshiba America Electronic Components, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Techniques for arranging ball grid arrays for producing low thermal resistance packages. One embodiment is for a ball grid array package that comprises a substrate, the substrate having a top surface and a bottom surface. A plurality of thermal balls are coupled to the bottom surface of the substrate, and at least one vias is positioned between every pair of the plurality of thermal balls. Other embodiments contemplate a ball grid array comprising thermal balls with a via located between every four thermal balls, wherein at least one vias is substituted for a thermal ball in the ball grid array.