The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Aug. 27, 2007
Tetsuya Yoshida, Oura-Gun, JP;
Mitsuyuki Kobayashi, Gifu, JP;
Tetsuya Yoshida, Oura-Gun, JP;
Mitsuyuki Kobayashi, Gifu, JP;
Sanyo Electric Co., Ltd., Moriguchi-shi, JP;
Sanyo Semiconductor Co., Ltd., Gunma, JP;
Sanyo Semiconductor Manufacturing Co., Ltd., Ojiya-shi, JP;
Abstract
As a discrete semiconductor chip, there has been known one that enables flip-chip mounting by providing first and second electrodes in a current path above a first surface of a semiconductor substrate. However, there is a problem that a horizontal current flow in the substrate increases resistance components. A first electrode and a second electrode, which are connected to an element region, are provided above a first surface. Moreover, a thick metal layer having corrosion resistance and oxidation resistance and also having a low resistance is provided above a second surface. Thus, resistance components of a current flowing in a horizontal direction of a substrate are reduced. Moreover, by appropriately selecting a thickness of the thick metal layer, a resistance value of a device can be reduced while suppressing a cost increase. Furthermore, by adopting Au as the thick metal layer, defects such as discoloration of the thick metal layer with time can be prevented.