The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Sep. 20, 2006
Applicant:
David C. H. Cheng, Taoyuan County, TW;
Inventor:
David C. H. Cheng, Taoyuan County, TW;
Assignee:
Unimicron Technology Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package substrate including a circuit board, a reinforcing plate and at least one conductive channel is provided. A first surface of the reinforcing plate is disposed on the circuit board for resisting the warpage of the circuit board. The reinforcing plate has an opening corresponding to a first contact of the circuit board exposed thereon. In addition, one end of the conductive channel is located in the opening and electrically connected to the first contact, and the other end of the conductive channel is located on a second surface of the reinforcing plate to form a bonding pad.