The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Aug. 27, 2007
Applicants:
Tomonao Takamatsu, Tokyo, JP;
Hideo Aoki, Kanagawa-ken, JP;
Kazunari Ishimaru, Kanagawa-ken, JP;
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/26 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device comprises: a semiconductor element; a mounting substrate with the semiconductor element mounted thereon; a first high thermal conductivity member formed on a surface of the mounting substrate; and a first cooling member thermally connected to at least a part of the first high thermal conductivity member. The first high thermal conductivity member is thermally connected to the semiconductor element, and the first high thermal conductivity member has an outer edge which is located outside an outer edge of the semiconductor element.