The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Oct. 10, 2008
Gregory P. Muldowney, Earleville, MD (US);
Gregory P. Muldowney, Earleville, MD (US);
Rohm and Haas Electronic, Newark, DE (US);
Electronic Materials CMP Holding, Inc., Newark, DE (US);
Abstract
The polishing pad () is useful for polishing at least one of magnetic, optical and semiconductor substrates () in the presence of a polishing medium (). The polishing pad () includes a three-dimensional network of interconnected unit cells (). The interconnected unit cells () are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements (and) form the three-dimensional network of interconnected unit cells (). The polishing elements (and) have a first end connected to a first adjacent polishing element at a first junction (and) and a second end connected to a second adjacent polishing element at a second junction (and) and having a cross-sectional area (and) that remains within 30% between the first and the second junctions (and). The polishing surface (and) formed from the plurality of polishing elements (and) remains consistent for multiple polishing operations.