The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
May. 29, 2008
Vincenzo Condorelli, Poughkeepsie, NY (US);
Claudius Feger, Poughkeepsie, NY (US);
Kevin C. Gotze, Poughkeepsie, NY (US);
Nihad Hadzic, Wappingers Falls, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
Edmund J. Sprogis, Underhill, VT (US);
Vincenzo Condorelli, Poughkeepsie, NY (US);
Claudius Feger, Poughkeepsie, NY (US);
Kevin C. Gotze, Poughkeepsie, NY (US);
Nihad Hadzic, Wappingers Falls, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
Edmund J. Sprogis, Underhill, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A physically secure processing assembly is provided that includes dies mounted on a substrate so as to sandwich the electrical contacts of the dies between the dies and the substrate. The substrate is provided with substrate contacts and conductive pathways that are electrically coupled to the die contacts and extend through the substrate. Electrical conductors surround the conductive pathways. A monitoring circuit detects a break in continuity of one or more of the electrical conductors, and preferably renders the assembly inoperable. Preferably, an epoxy encapsulation is provided to prevent probing tools from being able to reach the die or substrate contacts.