The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Nov. 06, 2006
Hyun-soo Chung, Hwasung, KR;
Seung-duk Baek, Yongin, KR;
Ju-il Choi, Suwon, KR;
Dong-ho Lee, Sungnam, KR;
Hyun-soo Chung, Hwasung, KR;
Seung-duk Baek, Yongin, KR;
Ju-il Choi, Suwon, KR;
Dong-ho Lee, Sungnam, KR;
Samsung Electronics Co., Ltd, Suwon-Si, KR;
Abstract
A method of forming a wire structure connecting to a bonding pad of a semiconductor chip includes depositing a passivation layer on an active surface of the semiconductor chip, depositing a seed metal layer on the bonding pad and the passivation layer, depositing a metal layer on the seed metal layer, etching selected portions of the seed metal layer, leaving unetched a first area, overlapping the bonding pad and a second area overlapping a connection pad, wherein the wire structure is formed by the metal layer being electrically connected to the bonding pad and the connection pad, but floating from the passivation layer, and depositing an insulting layer on the wire structure.