The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
May. 11, 2007
Applicant:
William Jeffery Reeder, Boise, ID (US);
Inventor:
William Jeffery Reeder, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for dicing a wafer is disclosed. One illustrative method includes forming a layer of frozen material above a plurality of integrated circuit dies on a substrate and performing a cutting process to cut through the layer of frozen material and the substrate to singulate the plurality of dies. Another method includes performing a cutting process to singulate a plurality of integrated circuit dies having a layer of frozen material formed above the plurality of dies.