The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
May. 01, 2008
Ka Shing Kenny Kwan, Singapore, SG;
Gang Ou, Singapore, SG;
Yong Wang, Singapore, SG;
Man Chan, Singapore, SG;
Ka Shing Kenny Kwan, Singapore, SG;
Gang Ou, Singapore, SG;
Yong Wang, Singapore, SG;
Man Chan, Singapore, SG;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile