The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Jan. 27, 2006
Naotaka Tanaka, Kasumigaura, JP;
Yasuhiro Yoshimura, Kasumigaura, JP;
Takahiro Naito, Kodaira, JP;
Takashi Akazawa, Musashimurayama, JP;
Naotaka Tanaka, Kasumigaura, JP;
Yasuhiro Yoshimura, Kasumigaura, JP;
Takahiro Naito, Kodaira, JP;
Takashi Akazawa, Musashimurayama, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
In order to implement a high-density high-performance semiconductor system small in size, there is provided a method for implementing three-dimensional connection between a plurality of semiconductor chips differing from each other with the shortest metal interconnect length, using penetration electrodes, thereby enabling a fast operation at a low noise level, the method being a three-dimensional connection method very low in cost, and short in TAT in comparison with the known example, capable of bonding at an ordinary temperature, and excellent in connection reliability.