The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2010

Filed:

Dec. 27, 2007
Applicants:

Fei Chen, Shenzhen, CN;

Di-qiong Zhao, Shenzhen, CN;

Yi-chyng Fang, Taipei Hsien, TW;

Yue-bin Wang, Shenzhen, CN;

Inventors:

Fei Chen, Shenzhen, CN;

Di-Qiong Zhao, Shenzhen, CN;

Yi-Chyng Fang, Taipei Hsien, TW;

Yue-Bin Wang, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A memory module assembly () includes a memory card () having a right side surface () and a left side surface (), a heat sink () and a heat pipe (). The heat sink includes a base member () attached to the left side surface of the memory card and a shell () attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion () attached to the left side surface of the memory card and a support portion () extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator () in thermal engagement with one of the shell and the substrate portion and a condenser () in thermal engagement with the support portion.


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