The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
May. 14, 2008
Shinsuke Miyabe, Tokyo, JP;
Kuniaki Maejima, Tokyo, JP;
Masahiro Izumi, Tokyo, JP;
Hiroaki Tanaka, Kanagawa, JP;
Shinsuke Miyabe, Tokyo, JP;
Kuniaki Maejima, Tokyo, JP;
Masahiro Izumi, Tokyo, JP;
Hiroaki Tanaka, Kanagawa, JP;
Nippon Chemical Industrial Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without causing scratches on the wiring metal, a method of producing the polishing composition, and a polishing method. The polishing composition for a semiconductor wafer comprises an acid and an aqueous medium dispersion containing positively-charged silica particles having an amino group-containing silane coupling agent bonded on a surface thereof, the polishing composition having a pH of 2 to 6.