The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2010

Filed:

Jan. 23, 2007
Applicants:

Tseng-hsiang HU, Taipei Hsien, TW;

Yeu-lih Lin, Taipei Hsien, TW;

Li-kuang Tan, Taipei Hsien, TW;

Inventors:

Tseng-Hsiang Hu, Taipei Hsien, TW;

Yeu-Lih Lin, Taipei Hsien, TW;

Li-Kuang Tan, Taipei Hsien, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 25/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light-emitting diode (LED) assembly includes a heat dissipation device () and at least one LED (). The heat dissipation device has a connecting surface () with circuitry () being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.


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