The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Dec. 19, 2006
Applicant:
Daisuke Fukuda, Kawasaki, JP;
Inventor:
Daisuke Fukuda, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 21/66 (2006.01); H01L 21/20 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
Abstract
A film thickness predicting apparatus compares a measurement value of a copper plating formed on wiring grooves of various patterns measured using a TEG and a film thickness of the copper plating calculated based on a plating model and a condition file. The film thickness predicting apparatus then delivers optimal plating model from the comparison result and calculates the film thickness of the copper plating formed on a substrate surface to be designed using the optimal plating model. The film thickness predicting apparatus enables to conduct a highly accurate film thickness predicting simulation.