The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Jun. 25, 2008
Shigeru Mizuno, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Shigeru Mizuno, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
A method of manufacturing a semiconductor device in which a semiconductor elementis mounted on a substratethrough a flip-chip connection, includes the steps of cladding gallium as a bonding materialto a connecting padformed on a surface of the substrate, diffusing copper from the connecting padformed of the copper into the bonding materialthrough heating under vacuum, thereby bringing a state of a solid solution of the gallium and the copper, and aligning a connecting bumpformed on the semiconductor elementwith the connecting padand bonding the connecting bumpto the connecting padthrough the bonding materialin a state of a solid solution under heating.