The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2010

Filed:

Jul. 14, 2005
Applicants:

Joseph C. Fjelstad, Maple Valley, WA (US);

Kevin P. Grundy, Fremont, CA (US);

Gary Yasumura, Santa Clara, CA (US);

Inventors:

Joseph C. Fjelstad, Maple Valley, WA (US);

Kevin P. Grundy, Fremont, CA (US);

Gary Yasumura, Santa Clara, CA (US);

Assignee:

Interconnect Portfolio LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed are IC package structures comprised of standard IC packages modified with separate circuit interconnection structures and disposed to interconnect either directly to other IC packages or to intermediate pedestal connectors which serve to support and interconnect various circuit elements, thus effectively allowing critical signals to bypass the generally less capable interconnection paths within standard interconnection substrates.


Find Patent Forward Citations

Fjelstad, Joseph. (2010). Ic package structures having separate circuit interconnection structures and assemblies constructed thereof (U.S. Patent No. 7750446). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7750446

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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