The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
May. 22, 2008
Michael P. Chudzik, Danbury, CT (US);
Bruce B. Doris, Brewster, NY (US);
Supratik Guha, Chappaqua, NY (US);
Rajarao Jammy, Hopewell Junction, NY (US);
Vijay Narayanan, New York, NY (US);
Vamsi K. Paruchuri, New York, NY (US);
Yun Y. Wang, Poughquag, NY (US);
Keith Kwong Hon Wong, Wappingers Falls, NY (US);
Michael P. Chudzik, Danbury, CT (US);
Bruce B. Doris, Brewster, NY (US);
Supratik Guha, Chappaqua, NY (US);
Rajarao Jammy, Hopewell Junction, NY (US);
Vijay Narayanan, New York, NY (US);
Vamsi K. Paruchuri, New York, NY (US);
Yun Y. Wang, Poughquag, NY (US);
Keith Kwong Hon Wong, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Semiconductor structures, such as, for example, field effect transistors (FETs) and/or metal-oxide-semiconductor capacitor (MOSCAPs), are provided in which the workfunction of a conductive electrode stack is changed by introducing metal impurities into a metal-containing material layer which, together with a conductive electrode, is present in the electrode stack. The choice of metal impurities depends on whether the electrode is to have an n-type workfunction or a p-type workfunction. The present invention also provides a method of fabricating such semiconductor structures. The introduction of metal impurities can be achieved by codeposition of a layer containing both a metal-containing material and workfunction altering metal impurities, forming a stack in which a layer of metal impurities is present between layers of a metal-containing material, or by forming a material layer including the metal impurities above and/or below a metal-containing material and then heating the structure so that the metal impurities are introduced into the metal-containing material.