The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2010

Filed:

Nov. 09, 2006
Applicants:

Xianbin Wang, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Liang-choo Hsia, Singapore, SG;

Teck Jung Tang, Johor Bahru, MY;

Huang Liu, Saingapore, SG;

Inventors:

Xianbin Wang, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Liang-Choo Hsia, Singapore, SG;

Teck Jung Tang, Johor Bahru, MY;

Huang Liu, Saingapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit processing system is provided including providing a substrate having an integrated circuit, forming an interconnect layer over the integrated circuit, applying a low-K dielectric layer over the interconnect layer, applying an ultra low-K dielectric layer over the low-K dielectric layer, forming an opening through the ultra low-K dielectric layer and the low-K dielectric layer to the interconnect layer, depositing an interconnect metal in the opening, and chemical-mechanical polishing the interconnect metal and the ultra low-K dielectric layer.


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