The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7749048 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 06, 2010

Filed:

May. 04, 2007
Applicants:

James C. Wang, Saratoga, CA (US);

Hung K. Nguyen, Milpitas, CA (US);

Sen-hou Ko, Cupertino, CA (US);

Wei-yung Hsu, Santa Clara, CA (US);

Inventors:

James C. Wang, Saratoga, CA (US);

Hung K. Nguyen, Milpitas, CA (US);

Sen-Hou Ko, Cupertino, CA (US);

Wei-Yung Hsu, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/00 (2006.01); B24B 51/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of operating a polishing apparatus in which a substrate is held with a carrier head supported by a movable support of the polishing apparatus, the substrate is brought into contact with a polishing surface at a polishing station of the polishing apparatus and the substrate is polished, the substrate is removed from the polishing surface, the support moves to transfer the carrier head to a different station of the polishing apparatus, and the polishing surface is conditioned. The conditioning overlaps with at least one of removing the substrate or moving the support.


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