The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Oct. 22, 2008
Jer-haur Kuo, Taipei Hsien, TW;
Xin-xiang Zha, Shenzhen, CN;
Ye-fei Yu, Shenzhen, CN;
Lin Yang, Shenzhen, CN;
Fang-xiang Yu, Shenzhen, CN;
Jer-Haur Kuo, Taipei Hsien, TW;
Xin-Xiang Zha, Shenzhen, CN;
Ye-Fei Yu, Shenzhen, CN;
Lin Yang, Shenzhen, CN;
Fang-Xiang Yu, Shenzhen, CN;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A securing device () is used for securing a heat sink () to a printed circuit board () with a heat-generating electronic component () mounted thereon. The securing device includes a V-shaped elongated main body (), a first locking leg (), a second locking leg () and a resilient member (). The first locking leg and second locking leg are connected to two opposite ends of the main body respectively for engaging with a retention frame () on the printed circuit board. The resilient member includes a planar-shaped supporting plate () engaging with a bottom portion of the main body and at least one resilient foot () extending downwardly from the supporting plate. The resilient foot deforms to exert a resilient force on the heat sink when the heat sink is assembled to the electronic component by the securing device.