The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2010

Filed:

Feb. 26, 2008
Applicants:

Deepak A. Ramappa, Cambridge, MA (US);

Rosa A. Orozco-teran, Plano, TX (US);

Laura Matz, Macungie, PA (US);

Inventors:

Deepak A. Ramappa, Cambridge, MA (US);

Rosa A. Orozco-Teran, Plano, TX (US);

Laura Matz, Macungie, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of measuring temperature across wafers during semiconductor processing includes the step of providing a correlation between a peak wafer temperature during a processing step and a change in wafer surface charge or surface potential following the processing step. A first wafer to be characterized for its peak temperature spatial distribution during the processing step is processed through the processing step. The wafer surface charge or surface potential at a plurality of locations on the first wafer are measured following the processing step. A peak temperature spatial distribution for the first wafer is then determined based on the correlation and the wafer surface charge or surface potential measured in the measuring step.


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Ramappa, Deepak. (2010). Monitoring of temperature variation across wafers during processing (U.S. Patent No. 7745238). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7745238

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