The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Apr. 25, 2007
Gerald Donald Andrews, Hockessin, DE (US);
Richard Kevin Bailey, Newark, DE (US);
Graciela Beatriz Blanchet, Wilmington, DE (US);
John W. Catron, Smyrna, DE (US);
Feng Gao, Hockessin, DE (US);
Gary Delmar Jaycox, West Chester, PA (US);
Lynda Kaye Johnson, Wilmington, DE (US);
Roupen Leon Keusseyan, Raleigh, NC (US);
Jeffrey Scott Meth, Landenberg, PA (US);
Frank S. Principe, Landenberg, PA (US);
Rinaldo S. Schiffino, Wilmington, DE (US);
Robert Mar Yohannan, Rutledge, PA (US);
Gerald Donald Andrews, Hockessin, DE (US);
Richard Kevin Bailey, Newark, DE (US);
Graciela Beatriz Blanchet, Wilmington, DE (US);
John W. Catron, Smyrna, DE (US);
Feng Gao, Hockessin, DE (US);
Gary Delmar Jaycox, West Chester, PA (US);
Lynda Kaye Johnson, Wilmington, DE (US);
Roupen Leon Keusseyan, Raleigh, NC (US);
Jeffrey Scott Meth, Landenberg, PA (US);
Frank S. Principe, Landenberg, PA (US);
Rinaldo S. Schiffino, Wilmington, DE (US);
Robert Mar Yohannan, Rutledge, PA (US);
E. I. du Pont de Nemours and Company, Wilmington, DE (US);
Abstract
Provided are processes for enhancing the resolution of a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.