The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Jun. 27, 2006
Toshiya Akamatsu, Kawasaki, JP;
Seiki Sakuyama, Kawasaki, JP;
Toshiya Akamatsu, Kawasaki, JP;
Seiki Sakuyama, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The method for bonding a semiconductor element comprises the step of applying to solder bumpsof a semiconductor chipa soldering fluxwhich contains a thermosetting resin, a polyhydric alcohol and an organic acid and in which the thermosetting resin remains uncured after reflow-bonding, the step of reflow-bonding the solder bumpsto the electrodesof the circuit boardwith the soldering fluxwhile melting the solder bumpsand the step of filling an underfill materialbetween the semiconductor chipand the circuit boardwith the soldering fluxbeing left, the underfill materialcontaining a thermosetting resin of the same group as the thermosetting resin contained in the soldering fluxand at least one of a curing agent and a cure catalyst for curing the thermosetting resins.