The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
Feb. 26, 2007
Tsuyoshi Ogawa, Kanagawa, JP;
Takahiko Kosemura, Kanagawa, JP;
Akira Muto, Tokyo, JP;
Akihiko Okubora, Kanagawa, JP;
Tsuyoshi Ogawa, Kanagawa, JP;
Takahiko Kosemura, Kanagawa, JP;
Akira Muto, Tokyo, JP;
Akihiko Okubora, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit () in which first to third unit wiring layers () to (), each having a capacitor () or the like at a part, are stacked and formed on flattened one surface of a dummy board () so that a third pattern wiring is exposed from a connection surface () of an uppermost layer is mounted on a mounting surface () of a base board () where an input/output terminal part () is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.