The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
Jul. 21, 2006
Minoru Ametani, Mitaka, JP;
Minoru Ametani, Mitaka, JP;
Tokyo Seimitsu Co., Ltd., Mitaka-shi, JP;
Abstract
A film separation apparatus () for separating a film () attached to a film application surface of a wafer () comprises a wafer adsorption unit () for adsorbing the wafer with the film application surface up, a release tape supply unit () for supplying the release tape () onto the film application surface, and a heating unit () for pressing and heating only a part of the release tape against the wafer film at an edge of the wafer. Thus, the adhesion between the release tape and the film is increased at the particular part of the release tape. The apparatus further comprises a peeling unit () for separating the film from the film application surface of the wafer using a release tape with a part of the release tape having an improved adhesion as a separation starting point. Thus, the surface protective film can be easily separated from the wafer.