The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Mar. 29, 2006
Masaki Ohno, Gifu, JP;
Masanori Tamaki, Gifu, JP;
Masaki Ohno, Gifu, JP;
Masanori Tamaki, Gifu, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A semiconductor mounting boardis prepared by electrically joining an IC chipvia an interposerof high rigidity to external padsand internal pads, which are formed on the uppermost surface of a build-up layer. When the IC chipgenerates heat, since padsare positioned away from the center, a large shearing stress is applied to the portions at which padsare joined to the interposerin comparison to the portions at which padsare joined to the interposer. Here, padsare formed at substantially flat wiring portions and thus when joined to the interposerby means of solder bumps, voids and angled portions, at which stress tends to concentrate, are not formed in the interiors of solder bumps. The joining reliability is thus high.