The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Dec. 06, 2006
Yoshiyuki Iwata, Ogaki, JP;
Yoshiyuki Iwata, Ogaki, JP;
Ibiden Co., Ltd., Ogaki, JP;
Abstract
The present invention intends to provide a novel printed wiring board manufacturing method by which printed wiring boards can be manufactured with efficiency. A method of manufacturing a printed wiring board (FIG.B) according to the present invention includes a step for preparing two sets of copper clad laminates (FIG.A), a step for bonding the copper clad laminates (FIG.B), steps for forming lands on both surfaces of a bonded laminate (FIGS.C toE), steps for forming respective resin layers on both surfaces of the bonded laminate and forming via hole openings to form respective via holes (FIGS.F toL), a step for forming a resin layer and forming a via hole opening to form a via hole (FIG.M), a step for separating the bonded laminate from each other (FIG.N) and steps for forming via hole openings from the bonded surface of the separated laminate to form via holes (FIGS.O toT). Via holes (--) formed on the resin layer and a via hole () formed on the laminate are opened in the opposite directions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile