The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Feb. 28, 2007
Markus Brunnbauer, Lappersdorf, DE;
Jesus Mennen Belonio, Dresden, DE;
Edward Fuergut, Dasing, DE;
Thorsten Meyer, Regensburg, DE;
Markus Brunnbauer, Lappersdorf, DE;
Jesus Mennen Belonio, Dresden, DE;
Edward Fuergut, Dasing, DE;
Thorsten Meyer, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a moldings cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied. The upper contact area is covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as an adhesive film forming an interface with the underside of the plastic housing composition, with the result that a warpage of the composite board of less than 1% is obtained.