The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Dec. 26, 2007
Pai-chou Liu, Kaohsiung, TW;
Hsin-fu Chuang, Ciaotou Township, Kaohsiung County, TW;
Pai-Chou Liu, Kaohsiung, TW;
Hsin-Fu Chuang, Ciaotou Township, Kaohsiung County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals is connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the corresponding exposed centers of the contact pad to prevent the fine pitch contact pads from bridging.