The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Dec. 28, 2006
Cheng-hsueh Su, Gangshan Town, Kaohsiung County, TW;
Hsing-fu LU, Kaohsiung, TW;
Tsung-chieh Ho, Kaohsiung, TW;
Shyh-ing Wu, Kaohsiung County, TW;
Cheng-Hsueh Su, Gangshan Town, Kaohsiung County, TW;
Hsing-Fu Lu, Kaohsiung, TW;
Tsung-Chieh Ho, Kaohsiung, TW;
Shyh-Ing Wu, Kaohsiung County, TW;
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Abstract
A method for forming a passivation layer is disclosed. In the method, a substrate containing a top surface and a bottom surface opposite to the top surface is first provided, wherein a plurality of conductive pads are disposed on the top surface thereof. Thereafter, a first passivation layer is formed on the top surface of the substrate, wherein the first passivation layer has a characteristic of photoresist. A first exposure/develop step is then performed to form a plurality of first openings in the first passivation layer, wherein the conductive pads are exposed through the first openings. Then, a second passivation layer is formed on the first passivation layer, wherein the second passivation layer has a characteristic of photoresist. A second exposure/develop step is then performed to form a plurality of second openings in the second passivation layer, wherein the conductive pads are exposed through the second openings.