The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Jun. 08, 2005
Kiichiro Kato, Warabi, JP;
Kazuhiro Tsuda, Warabi, JP;
Yumiko Matsubayashi, Warabi, JP;
Lintec Corporation, Tokyo, JP;
Abstract
To provide a pressure-sensitive adhesive sheet according to which air entrapment and blistering can be prevented or eliminated via through-holes, and yet the appearance compares favorably with that of a pressure-sensitive adhesive sheet having no through-holes therein, as a substratethere is used one having a surface roughness (Ra) of not less than 0.03 μm, a lightness (L*) in the L*a*b* color system of not more than 60 in the case of having a chroma (C*) of not more than 60 and a lightness (L*) of not more than 85 in the case of having a chroma (C*) greater than 60, and a contrast ratio of not less than 90%, through-holespassing through the substrateand a pressure-sensitive adhesive layerare made to have a diameter in the substrateand the pressure-sensitive adhesive layerof from 0.1 to 200 μm, a diameter at a surface of the substrateof from 0.1 to 42 μm, and a hole density of from 30 to 50,000 per 100 cm, in the case that melted portions formed by a laser are present around the through-holesat the surface of the substrate, the melted portions are made to have an outside diameter of not more than 50 μm, and in the case that thermally deformed portions are present around the through-holesat the surface of the substrate, the thermally deformed portions are made to have an outside diameter of not more than 180 μm.