The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2010

Filed:

Mar. 14, 2008
Applicants:

Marc Laverdiere, Wakefield, MA (US);

Robert F. Mcloughlin, Pelham, NH (US);

Michael Clarke, Bedford, MA (US);

Dale Maenke, Chaska, MN (US);

Wiley James Wilkinson, Chanhassen, MN (US);

Inventors:

Marc Laverdiere, Wakefield, MA (US);

Robert F. McLoughlin, Pelham, NH (US);

Michael Clarke, Bedford, MA (US);

Dale Maenke, Chaska, MN (US);

Wiley James Wilkinson, Chanhassen, MN (US);

Assignee:

Entegris, Inc., Billerica, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 5/00 (2006.01); G01K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments disclosed herein provide a non-intrusive thermal (NIT) monitor for sensing temperatures useful for semiconductor manufacturing applications. In some embodiments, a NIT monitor comprises a thermopile, a fluid housing with a fluid window, and an elongated member positioned between the thermopile and the fluid window for transmitting or reflecting infrared signals corresponding to a temperature of a fluid in the fluid housing. The fluid housing may have a cross-sectional profile to enable the manipulation of the fluid flow under the fluid window, enhancing the speed and accuracy of the temperature sampling. The elongated member, which may be hollow and coated with gold, may an extended piece of the fluid housing or a part of an optics housing. In some embodiments, the NIT monitor is connected to a main conditioning circuit board via a cable for processing the temperature measurements at a remote location.


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