The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Mar. 13, 2006
Takashi Ichiryu, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Yoshihiro Tomita, Osaka, JP;
Koichi Hirano, Osaka, JP;
Toshio Fujii, Osaka, JP;
Takashi Ichiryu, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Yoshihiro Tomita, Osaka, JP;
Koichi Hirano, Osaka, JP;
Toshio Fujii, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.