The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Dec. 12, 2005
Chi Wah Cheng, Hong Kong, CN;
Hoi Shuen Joseph Tang, Hong Kong, CN;
Tim Wai Tony Mak, Hong Kong, CN;
See Lok Chan, Hong Kong, CN;
Chi Wah Cheng, Hong Kong, CN;
Hoi Shuen Joseph Tang, Hong Kong, CN;
Tim Wai Tony Mak, Hong Kong, CN;
See Lok Chan, Hong Kong, CN;
ASM Assembly Automation Ltd., , HK;
Abstract
An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.