Wafer bonded composite structure for thermally matching a readout circuit (roic) and an infrared detector chip both during and after hybridization

Abstract

A wafer bonded composite structure is provided for matching a coefficient of thermal expansion of a first semiconductor chip to a coefficient of thermal expansion of a second semiconductor chip in order to provide a thermally matched hybridized semiconductor chip assembly. The wafer bonded composite structure includes a first semiconductor chip having a top and a bottom surface. The first semiconductor chip has a coefficient of thermal expansion which is less than the coefficient of thermal expansion of the second semiconductor chip. Preferably, the first semiconductor chip is an readout integrated circuit (ROIC) and the second semiconductor chip is an infrared detector chip. Further, the wafer bonded composite structure also includes a substrate wafer bonded to a bottom surface of the first semiconductor chip to form the wafer bonded composite structure itself. The wafer bonded substrate is preferably transparent to infrared radiation, so that the first semiconductor chip or ROIC of the resulting wafer bonded composite structure may be aligned with the second semiconductor chip or infrared detector chip before hybridization has taken place. Moreover, the composite structure has a coefficient of thermal expansion which at least substantially matches the coefficient of thermal expansion of the second semiconductor chip, thereby providing thermal matching between the first and second semiconductor chips.