The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Aug. 21, 2008
Majid Aghababazadeh, San Jose, CA (US);
Jose J. Estabil, Weston, CT (US);
Nader Pakdaman, Monte Serano, CA (US);
Gary L. Steinbrueck, Wappingers, NY (US);
James S. Vickers, San Jose, CA (US);
Majid Aghababazadeh, San Jose, CA (US);
Jose J. Estabil, Weston, CT (US);
Nader Pakdaman, Monte Serano, CA (US);
Gary L. Steinbrueck, Wappingers, NY (US);
James S. Vickers, San Jose, CA (US);
tau-Metrix, Inc., Santa Clara, CA (US);
Abstract
A system is provided for using test structures to evaluate a fabrication of a wafer. The test structures include a combination of device and interconnect elements that are provided on an active region of a die, on the wafer prior to the fabrication of the wafer being completed. The combination of device and interconnect elements include one or more circuits that are activatable to produce an output corresponding to measurable electrical and/or optical characteristics. A power receiving element that is configured to receive activation energy sufficient to cause the output on a contactless medium, so that the activation energy is received without affecting a usability of the die or wafer. The one or more circuits are structured to generate a variation in either the output or in a parameter determined from output, as a result of a process variation in a specific fabrication step that provided elements for forming the one or more circuits. A detector is provided to detect the output over the contactless medium, so as to receive the output without affecting a usability of the wafer when fabrication is completed.