The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Aug. 30, 2005
Applicants:
Masanori Kawade, Obu, JP;
Hiroyuki Tsuruga, Ogaki, JP;
Makoto Ebina, Obu, JP;
Inventors:
Assignees:
IBIDEN Co., Ltd., Ogaki-shi, JP;
TIBC Co., Ltd., Obu-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/04 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.