The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Jun. 14, 2006
Darrell G. Hill, Tempe, AZ (US);
Philip H. Bowles, Fountain Hills, AZ (US);
Jan Campbell, McCaskill, AK (US);
Terry K. Daly, Gilbert, AZ (US);
Jason R. Fender, Chandler, AZ (US);
Lakshmi N. Ramanathan, Chandler, AZ (US);
Neil T. Tracht, Mesa, AZ (US);
Darrell G. Hill, Tempe, AZ (US);
Philip H. Bowles, Fountain Hills, AZ (US);
Jan Campbell, McCaskill, AK (US);
Terry K. Daly, Gilbert, AZ (US);
Jason R. Fender, Chandler, AZ (US);
Lakshmi N. Ramanathan, Chandler, AZ (US);
Neil T. Tracht, Mesa, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method is provided for forming a microelectronic assembly. A contact structure () is formed over a first side of a first substrate () having a microelectronic device formed over a second side thereof. The contact structure is electrically connected to the microelectronic device. A non-solderable layer () is formed over at least a portion of the contact structure and at least a portion of the first substrate. The contact structure and a second substrate () are interconnected with solder ().