The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Nov. 28, 2007
Shunichi Aikawa, Yokohama, JP;
Jyouji Kimura, Yokohama, JP;
Keiji Tsuda, Yokohama, JP;
Kazunori Inoue, Kawasaki, JP;
Takashi Matsuda, Kawasaki, JP;
Shunichi Aikawa, Yokohama, JP;
Jyouji Kimura, Yokohama, JP;
Keiji Tsuda, Yokohama, JP;
Kazunori Inoue, Kawasaki, JP;
Takashi Matsuda, Kawasaki, JP;
Fujitsu Media Devices Limited, Yokohama, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of manufacturing an acoustic wave device includes: forming a conductive pattern on a wafer made of a piezoelectric substrate having an acoustic wave element, the conductive pattern including a first conductive pattern being continuously formed on a cutting region for individuating the wafer, a second conductive pattern being formed on an electrode region where a plated electrode is to be formed and being connected to the acoustic wave element and a third conductive pattern connecting the first conductive pattern and the second pattern; forming an insulating layer on the wafer so as to have an opening on the second conductive pattern; forming the plated electrode on the second conductive pattern by providing an electrical current to the second conductive pattern via the first conductive pattern and the third conductive pattern; and cutting off and individuating the wafer along the cutting region.