The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Mar. 06, 2008
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Tatsuo Kunishi, Moriyama, JP;
Jun Nishikawa, Fukui, JP;
Yoshihiko Takano, Otsu, JP;
Shigeyuki Kuroda, Sabae, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Tatsuo Kunishi, Moriyama, JP;
Jun Nishikawa, Fukui, JP;
Yoshihiko Takano, Otsu, JP;
Shigeyuki Kuroda, Sabae, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.