The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2010

Filed:

Jun. 04, 2008
Applicants:

Takashi Noma, Ota, JP;

Hiroyuki Shinogi, Ora-gun, JP;

Yukihiro Takao, Nitta-gun, JP;

Inventors:

Takashi Noma, Ota, JP;

Hiroyuki Shinogi, Ora-gun, JP;

Yukihiro Takao, Nitta-gun, JP;

Assignee:

Sanyo Electric Co., Ltd., Moriguchi-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of a semiconductor device of this invention includes forming metal pads on a Si substrate through a first oxide film, bonding the Si substrate and a holding substrate which bolsters the Si substrate through a bonding film, forming an opening by etching the Si substrate followed by forming a second oxide film on a back surface of the Si substrate and in the opening, forming a wiring connected to the metal pads after etching the second oxide film, forming a conductive terminal on the wiring, dicing from the back surface of the Si substrate to the bonding film and separating the Si substrate and the holding substrate.


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